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  september 2011 doc id 11214 rev 3 1/9 9 stps40120c power schottky rectifier features high junction temperature capability avalanche rated low leakage current good trade-off between leakage current and forward voltage drop description dual center tap schottky rectifier suited for high frequency switch mode power supply. packaged in to-220ab, to-220ab narrow leads and i 2 pak, this device is intended to be used in notebook and lcd adaptors, desktop smps, providing in these applications a margin between the remaining voltages applied on the diode and the voltage capability of the diode. table 1. device summary i f(av) 2 x 20 a v rrm 120 v t j(max) 175 c v f(typ) 0.57 v k k a2 a1 k k a2 a1 to-220ab stps40120ct k a1 a2 i 2 pak stps40120cr to-220ab narrow leads stps40120ctn a1 a2 k k www.st.com
characteristics stps40120c 2/9 doc id 11214 rev 3 1 characteristics when the diodes 1 and 2 are used simultaneously: t j (diode 1) = p(diode 1) x r th(j-c) (per diode) + p(diode 2) x r th(c) table 2. absolute ratings (limiting values, per diode) symbol parameter value unit v rrm repetitive peak reverse voltage 120 v i f(rms) forward rms current 30 a i f(av) average forward current = 0.5 t c = 145 c per diode per device 20 40 a i fsm surge non repetitive forward current t p = 10 ms sinusoidal 200 a p arm repetitive peak avalanche power t p = 1 s, t j = 25 c 10500 w t stg storage temperature range -65 to + 175 c t j maximum operating junction temperature (1) 1. condition to avoid runaway for a diode on its own heatsink 175 c table 3. thermal parameters symbol parameter value unit r th(j-c) junction to case per diode to t a l 1.6 0.85 c/w r th(c) coupling total 0.1 c/w table 4. static electrical characteristics (per diode) symbol test conditions min. typ. max. unit i r (1) 1. pulse test: t p = 5 ms, < 2% reverse leakage current t j = 25 c v r = v rrm 25 a t j = 125 c 4 12 ma v f (2) 2. pulse test: t p = 380 s, < 2% to evaluate the maximum conduction losses use the following equation: p = 0.58 x i f(av) + 0.0075 i f 2 (rms) forward voltage drop t j = 25 c i f = 7.5 a 0.73 v t j = 125 c 0.57 0.61 t j = 25 c i f = 20 a 0.9 t j = 125 c 0.69 0.73 t j = 25 c i f = 40 a 1 t j = 125 c 0.83 0.88 d ptot dtj - -------------- 1 rth j a ? () ------------------------- - <
stps40120c characteristics doc id 11214 rev 3 3/9 figure 1. average forward power dissipation versus average forward current (per diode) figure 2. average forward current versus ambient temperature ( = 0.5, per diode) 0 2 4 6 8 10 12 14 16 18 20 0 2 4 6 8 1012141618202224 p (w) f(av) t =tp/t tp = 1 = 0.05 i (a) f(av) = 0.5 = 0.2 = 0.1 0 2 4 6 8 10 12 14 16 18 20 22 0 25 50 75 100 125 150 175 i (a) f(av) t =tp/t tp t (c) amb r =15c/w th(j-a) r=r th(j-a) th(j-c) figure 3. normalized avalanche power derating versus pulse duration figure 4. normalized avalanche power derating versus junction temperature 0.001 0.01 0.1 0.01 1 0.1 10 100 1000 1 t (s) p p(t p ) p (1 s) arm arm 0 0.2 0.4 0.6 0.8 1 1.2 25 50 75 100 125 150 t (c) j p(t j ) p (25 c) arm arm figure 5. non repetitive surge peak forward current versus overload duration (maximum values, per diode) figure 6. relative variation of thermal impedance junction to ambient versus pulse duration 0 20 40 60 80 100 120 140 160 180 200 220 240 1.e-03 1.e-02 1.e-01 1.e+00 i (a) m i m t =0.5 t =25c c t =75c c t =125c c t(s) 0.0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0 1.e-03 1.e-02 1.e-01 1.e+00 z/r th(j-c) th(j-c) t =tp/t tp t (s) p = 0.5 = 0.2 = 0.1 single pulse
characteristics stps40120c 4/9 doc id 11214 rev 3 figure 9. forward voltage drop versus forward current (per diode) figure 7. reverse leakage current versus reverse voltage applied (typical values, per diode) figure 8. junction capacitance versus reverse voltage applied (typical values, per diode) 1.e-05 1.e-04 1.e-03 1.e-02 1.e-01 1.e+00 1.e+01 1.e+02 0 10 20 30 40 50 60 70 80 90 100 110 120 i (ma) r v (v) r t =125c j t =25c j t =50c j t =75c j t =100c j t =150c j 10 100 1000 1 10 100 c(pf) v (v) r f=1mhz v =30mv t =25c osc rms j 1 10 100 0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 i (a) fm v (v) fm t =25c (maximum values) j t =125c (maximum values) j t =125c (typical values) j
stps40120c package information doc id 11214 rev 3 5/9 2 package information epoxy meets ul94, v0 cooling method: by conduction (c) recommended torque value: 0.4 to 0.6 nm in order to meet environmental requirements, st offers these devices in different grades of ecopack ? packages, depending on their level of environmental compliance. ecopack ? specifications, grade definitions and product status are available at: www.st.com . ecopack ? is an st trademark. figure 10. to-220ab dimensions ref. dimensions millimeters inches min. max. min. max. a 4.40 4.60 0.173 0.181 c 1.23 1.32 0.048 0.051 d 2.40 2.72 0.094 0.107 e 0.49 0.70 0.019 0.027 f 0.61 0.88 0.024 0.034 f1 1.14 1.70 0.044 0.066 f2 1.14 1.70 0.044 0.066 g 4.95 5.15 0.194 0.202 g1 2.40 2.70 0.094 0.106 h2 10 10.40 0.393 0.409 l2 16.4 typ. 0.645 typ. l4 13 14 0.511 0.551 l5 2.65 2.95 0.104 0.116 l6 15.25 15.75 0.600 0.620 l7 6.20 6.60 0.244 0.259 l9 3.50 3.93 0.137 0.154 m 2.6 typ. 0.102 typ. diam. 3.75 3.85 0.147 0.151 a c d l7 dia l5 l6 l9 l4 f h2 g g1 l2 f2 f1 e m
package information stps40120c 6/9 doc id 11214 rev 3 table 5. to-220ab narrow leads dimensions ref. dimensions millimeters inches min. typ. max. min. typ. max. a 4.40 4.60 0.17 0.18 b 0.61 0.88 0.024 0.034 b1 0.95 1.20 0.037 0.047 c 0.48 0.70 0.019 0.027 d 15.25 15.75 0.60 0.62 d1 1.27 0.05 e 10.00 10.40 0.39 0.41 e 2.40 2.70 0.094 0.106 e1 4.95 5.15 0.19 0.20 f 1.23 1.32 0.048 0.052 h1 6.20 6.60 0.24 0.26 j1 2.40 2.72 0.095 0.107 l 13.00 14.00 0.51 0.55 l1 2.60 2.90 0.102 0.114 l20 15.40 0.61 l30 28.90 1.14 ? p 3.75 3.85 0.147 0.151 q 2.65 2.95 0.104 0.116 e p q l30 l20 l1 b1(x3) b (x3) e l e1 1 23 f d d1 h1 a j1 c
stps40120c package information doc id 11214 rev 3 7/9 devices in i 2 pak with nickel-plated back frame must not be mounted by frame soldering like smds. such devices are intended to be through-hole mounted only and in no circumstances shall st be held liable for any lack of performance or damage arising out of soldering of nickel-plated back frames. table 6. i 2 pak dimensions ref. dimensions millimeters inches min. max. min. max. a 4.40 4.60 0.173 0.181 a1 2.40 2.72 0.094 0.107 b 0.61 0.88 0.024 0.035 b1 1.14 1.70 0.044 0.067 c 0.49 0.70 0.019 0.028 c2 1.23 1.32 0.048 0.052 d 8.95 9.35 0.352 0.368 e 2.40 2.70 0.094 0.106 e1 4.95 5.15 0.195 0.203 e 10 10.40 0.394 0.409 l 13 14 0.512 0.551 l1 3.50 3.93 0.138 0.155 l2 1.27 1.40 0.050 0.055 e l2 l1 b1 d a1 c c2 a b e e1 l
ordering information stps40120c 8/9 doc id 11214 rev 3 3 ordering information 4 revision history table 7. ordering information order code marking package weight base qty delivery mode stps40120ct stps40120ct to-220ab 2.2 g 50 tube stps40120cr stps40120cr i 2 pak 1.49 g 50 tube stps40120ctn ps40120ctn to-220ab narrow leads 1.9 g 50 tube table 8. document revision history date revision changes 18-feb-2005 1 first issue 1-dec-2006 2 reformatted to current standards. added i 2 pak. 15-sep-2011 3 added to-220ab narrow leads package.
stps40120c doc id 11214 rev 3 9/9 please read carefully: information in this document is provided solely in connection with st products. stmicroelectronics nv and its subsidiaries (?st ?) reserve the right to make changes, corrections, modifications or improvements, to this document, and the products and services described he rein at any time, without notice. all st products are sold pursuant to st?s terms and conditions of sale. purchasers are solely responsible for the choice, selection and use of the st products and services described herein, and st as sumes no liability whatsoever relating to the choice, selection or use of the st products and services described herein. no license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted under this document. i f any part of this document refers to any third party products or services it shall not be deemed a license grant by st for the use of such third party products or services, or any intellectual property contained therein or considered as a warranty covering the use in any manner whatsoev er of such third party products or services or any intellectual property contained therein. unless otherwise set forth in st?s terms and conditions of sale st disclaims any express or implied warranty with respect to the use and/or sale of st products including without limitation implied warranties of merchantability, fitness for a parti cular purpose (and their equivalents under the laws of any jurisdiction), or infringement of any patent, copyright or other intellectual property right. unless expressly approved in writing by two authorized st representatives, st products are not recommended, authorized or warranted for use in milita ry, air craft, space, life saving, or life sustaining applications, nor in products or systems where failure or malfunction may result in personal injury, death, or severe property or environmental damage. st products which are not specified as "automotive grade" may only be used in automotive applications at user?s own risk. resale of st products with provisions different from the statements and/or technical features set forth in this document shall immediately void any warranty granted by st for the st product or service described herein and shall not create or extend in any manner whatsoev er, any liability of st. st and the st logo are trademarks or registered trademarks of st in various countries. information in this document supersedes and replaces all information previously supplied. the st logo is a registered trademark of stmicroelectronics. all other names are the property of their respective owners. ? 2011 stmicroelectronics - all rights reserved stmicroelectronics group of companies australia - belgium - brazil - canada - china - czech republic - finland - france - germany - hong kong - india - israel - ital y - japan - malaysia - malta - morocco - philippines - singapore - spain - sweden - switzerland - united kingdom - united states of america www.st.com


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